[Formula]: (mass)
Linoleic acid dimerized epoxy resin glyceride 100
1,6-Hexanediamine 35
Polypropylene glycol epoxy glyceryl ether 180
Polyoxypropylene triol 25
Silica 25.9
Aluminum oxide powder 635
[Preparation Method]: After mixing the three prepolymers, add silica and alumina powder, then add hexamethylenediamine, stir to obtain a soft epoxy adhesive
【Usage】: After sizing, it is cured at 93°C. The shear strength after curing is 689 to 3445 KPa. Used for bonding between electronic components and circuit boards.
Source: 21st Century Fine Chemicals Network
